PCB Manufacturing
Infrastructure & Capabilities

Capable equipment, controlled workflows, and integrated services — supporting quick-turn prototypes and volume production without compromising process discipline.

25+ Years of Operation
6 Process Stages
100% In-house E-Test
24h Express Turnaround

Production flow

Key Manufacturing Stages

Every board passes through a defined sequence of process steps — each with in-process checks before the next stage begins.

Precision photolithographic imaging transfers your Gerber data onto the copper-clad laminate. Controlled UV exposure ensures consistent line width and spacing across the panel. Each panel is inspected post-exposure before development to catch any registration or exposure anomalies early in the flow.

Unwanted copper is chemically removed after etching — leaving only the defined circuit traces. Process parameters including etch rate, temperature, and chemistry concentration are monitored continuously to maintain etch consistency panel-to-panel and shift-to-shift.

CNC drilling creates vias, through-holes, and mounting holes to your drill file specifications. Drill accuracy and registration are verified before the plating stage. Drill bits are monitored for wear, and stack heights are controlled to ensure burr-free, clean hole walls critical for reliable plating adhesion.

Electroless copper deposition seeds the hole wall, followed by electrolytic copper build-up to create reliable plated-through-hole connections. Plating thickness is controlled to IPC-6012 specification. Bath chemistry is analysed regularly to maintain uniform deposition quality across the entire panel surface.

Liquid photo-imageable (LPI) solder mask is applied, exposed, and cured to protect the copper circuit from oxidation and flux attack during assembly. Silkscreen legend is then printed and UV-cured for component reference designators, polarity markers, and branding — verified against your assembly data.

HASL (lead and lead-free), ENIG, and OSP finishes are applied to exposed pads to prevent oxidation and ensure long-term solderability — matched to your specification and assembly process. Finish thickness and coverage are inspected before boards proceed to final electrical test and outgoing QC.

Quality in-line

Inspection at Every Stage

We don't rely on a single end-of-line check. Inspection is integrated into the production flow so defects are caught and corrected before they compound into the next process step.

Our AOI system compares each panel against your Gerber reference data, and 100% electrical testing confirms every net is continuous and isolated before dispatch.

  • In-process visual inspection post-etch and post-drill
  • Automated Optical Inspection (AOI) — opens, shorts, dimensional checks
  • 100% electrical continuity and isolation testing (E-test)
  • Dimensional verification — board outline, hole size, copper clearance
  • Impedance coupon testing for controlled-impedance orders
  • Final outgoing QC before packaging and dispatch

Testing & Inspection Equipment

Automated Optical Inspection
AOI system for bare board verification against Gerber data — detects opens, shorts, and dimensional deviations
Electrical Test
100% E-test on every board — continuity and isolation verified across all nets before dispatch
Visual Inspection
In-process and final visual inspection stations with trained operators at each production stage
Dimensional Measurement
Board outline, drill registration, and copper geometry verification to your drawing tolerances
Impedance Testing
Coupon-based controlled impedance verification for high-speed and RF designs

Assembly floor

SMT & Through-Hole Assembly

Our assembly area handles SMT, through-hole, and mixed builds — with controlled processes aligned to IPC Class 2 and 3 workmanship standards.

Solder Paste Printing

Semi-automatic paste printer with vision alignment — stencil-controlled paste deposition for consistent solder volume on each pad before component placement.

SMT Pick & Place

Automated pick-and-place for SMT components — programmed from your centroid data for accurate, repeatable placement at speed across both sides of the board.

Reflow Soldering

Controlled reflow oven with profiled temperature zones — lead and lead-free compatible, with thermal profiling available for complex or thermally sensitive assemblies.

Wave Soldering

Wave soldering for through-hole and mixed assemblies — with flux application and controlled preheat for consistent solder joints on connectors and large components.

Hand Soldering

Temperature-controlled stations for selective, rework, and odd-form components — operators trained to IPC workmanship standards for consistent hand-solder quality.

Post-Assembly Inspection

Visual inspection, AOI, and functional test options post-assembly to verify solder quality, component presence, and polarity before boards are released.

Single source advantage

Fabrication, Assembly & Sourcing — One Partner

Customers benefit when fabrication, assembly support, stencil supply, and component sourcing all come from one coordinated partner. That integration reduces hand-off risk and keeps schedules aligned across the full program.

Your board data, BOM, and revision history are held centrally — so re-orders, engineering changes, and scale-ups don't require re-qualification from scratch.

Whether you are validating a new design or ramping to volume, our infrastructure is geared to respond with speed — including express options for urgent prototypes and time-critical production schedules.

Gandhinagar, Gujarat

Schedule a Facility Visit

We welcome customers to visit our Gandhinagar facility or arrange a video walkthrough. Connect with our team to discuss capacity, lead times, and technical fit.

Ready to run your boards with us?

Send your Gerber files for a quote, or contact us to discuss capacity and lead time for your specific board.