Laser-cut stainless steel stencils from your Gerber aperture data — consistent solder paste deposition for reliable SMT assembly. Framed, frameless, and stepped options available.
Service Overview
Stencil quality is the foundation of SMT yield. Poor aperture accuracy or inconsistent thickness is one of the leading root causes of solder defects — bridging, insufficient solder, and component tombstoning all trace back to paste deposition.
Our stencils are laser-cut from stainless steel directly from your Gerber aperture data and sized precisely to your paste printer and panel arrangement. We cut to your squeegee width, fiducial position, and frame type.
Key Specifications
Stencil Types
Accepted File Formats
Send your Gerber file and panel dimensions — we'll confirm pricing and lead time quickly.
Stencil Types
Each stencil type serves a different production environment and board complexity. We help you choose the right format.
Stainless steel foil permanently tensioned in an aluminium frame. Provides consistent tension and repeatability — the standard choice for medium to high-volume SMT lines.
Bare stainless steel foil without a frame — used with a universal reusable frame adapter. Lower cost per stencil, easier storage and shipping. Ideal for prototypes and small runs.
Variable-thickness stencil with different foil heights in different zones — essential for boards with a mix of standard SMT components and large connectors or fine-pitch devices that need different paste volumes.
Nickel stencil grown by electrodeposition — ultra-smooth aperture walls for superior paste release, especially for micro-pitch BGA and ultra-fine apertures below 0.08 mm. Higher cost but maximum precision.
Technical Specifications
Standard capability parameters — contact us for non-standard dimensions or tolerances.
Simple Process
From Gerber upload to delivered stencil — a quick, straightforward process.
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Design Guidelines
Following these guidelines improves paste transfer and reduces defects. Our team will flag issues during review.
Aperture area ÷ wall area should be ≥ 0.66 for reliable paste release. Small apertures with thick stencils retain paste — reduce thickness or increase aperture size.
Reduce apertures 5–10% on each side versus pad size to prevent bridging — especially on fine-pitch QFP and 0402 pads.
Round apertures with 1:1 ratio to ball diameter for BGA. For 0.4 mm pitch BGA, keep aperture at 0.30–0.35 mm diameter with 0.12 mm stencil thickness.
Use 0.12–0.15 mm for general SMT. Use 0.10 mm for 0402/0201 and fine-pitch. Use stepped stencil when you need different paste volumes on the same board.
Include at least 3 fiducial marks on panel corners in the Gerber. Global fiducials for printer alignment; local fiducials for fine-pitch components.
Ensure the paste Gerber layer has no stray flashes, text, or non-aperture objects. We review and will flag issues — but a clean layer speeds up production.
Related
Fabrication, assembly, and sourcing — complete support for your build.
Share your Gerber paste layer and panel details — we'll respond with pricing and lead time.
