ISO 9001:2015 · IPC Class 2 & 3 · Gandhinagar, Gujarat

PCB Assembly
SMT · THT · Mixed

Turnkey and consigned assembly with authentic components from authorised distribution. IPC-aligned workflows from prototype to production — under the same roof as fabrication.

  • SMT · THT · Mixed Assembly
  • IPC Class 2 & Class 3
  • Authentic Parts Only
  • AOI & Electrical Test
  • Turnkey or Consigned
  • BGA & Fine-Pitch Support
SMTReflow soldering
THTWave & hand solder
AOIAutomated inspection
IPC-3High-reliability class
1 pcNo minimum order quantity

Service Overview

Where Design Becomes Product

Assembly is the most process-sensitive step in the PCB supply chain. We apply the same discipline to assembly that we bring to fabrication — verified components, documented work instructions, and inspection at every stage.

We support SMT, through-hole, and mixed assemblies. Both turnkey (we source everything) and consigned (you supply components) models are available — matched to your project requirements.

Surface Mount (SMT) Through-Hole (THT) Mixed SMT+THT BGA / Fine-Pitch Turnkey Consigned
ISO 9001:2015 Certified facility
IPC Class 2 (commercial) & Class 3 (high-reliability)
Authentic parts — no counterfeit or grey-market components

Key Specifications

0201Min. SMT component size
0.4 mmMin. BGA ball pitch
510×460Max. board size (mm)
50×50Min. board size (mm)
8-zoneReflow oven profile
Class 3Max. IPC standard

Solder Processes

Reflow Soldering Wave Soldering Selective Soldering Hand Soldering

Inspection Methods

AOI Visual Inspection Electrical Test Functional Test
Get Assembly Quote

Send your Gerber, BOM, and centroid (CPL) file — we’ll return pricing and lead time.

  • Gerber + BOM + CPL files needed
  • Free BOM availability review
  • Turnkey or consigned — your choice
  • DFA feedback included
  • 1 piece to full production run
Get Instant Quote Talk to our engineering team

Assembly Types

What type of assembly do you need?

We support every assembly technology — choose based on your component mix and design requirements.

SMT Assembly

Surface-mount technology — components placed directly on board pads and reflowed. Supports 0201 passives, QFP, SOIC, BGA, and fine-pitch ICs up to 0.4 mm pitch.

Best for: High-density, modern designs

Through-Hole (THT)

Components inserted into drilled holes and soldered by wave or selective process. Essential for connectors, transformers, high-power components, and designs requiring mechanical strength.

Best for: Connectors, power, industrial

Mixed Assembly (SMT+THT)

Boards carrying both SMT and through-hole components. SMT reflow is completed first, followed by THT insertion and wave/selective soldering — with masking to protect SMT joints.

Best for: Complex, mixed-component designs

Technical Capabilities

Assembly specifications

Our process parameters for SMT, THT, and mixed assembly. Contact us for requirements outside standard capability.

Parameter Specification
Assembly TypesSMT, Through-hole (THT), Mixed SMT+THT
IPC StandardIPC Class 2 (commercial) and IPC Class 3 (high-reliability)
Min. SMT Component0201 (imperial) passives; 0.4 mm BGA ball pitch
Max. Board Size510 × 460 mm
Min. Board Size50 × 50 mm
Reflow Oven8-zone lead-free reflow; lead profiles on request
Solder PasteLead-free SAC305 (standard); leaded Sn63/Pb37 available
Component SupplyFull turnkey (we source) or consigned (customer-supplied)
Component PolicyAuthorised distribution only — no grey-market or counterfeit parts
InspectionVisual inspection, AOI, in-circuit electrical test
Functional TestAvailable on request — requires test fixture or customer-supplied test procedure
Files RequiredGerber/ODB++, BOM (XLS/CSV), Centroid/CPL file, Assembly drawings

Simple Process

How to Order PCB Assembly in 3 Steps

From BOM upload to assembled and tested boards — a clear process with engineering support throughout.

Step 1 image
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Quality Standards

IPC Class 2 vs Class 3 — which do you need?

We support both IPC classes. The right choice depends on your end application and reliability requirements.

IPC Class 2 Dedicated Service Products

Commercial & Industrial Electronics

Suitable for most consumer, industrial, and commercial electronics where extended life is required but service interruption is tolerated. Our standard workflow.

  • Consumer electronics, instrumentation
  • Industrial controls, IoT devices
  • Telecom, LED systems
IPC Class 3 High-Reliability

Mission-Critical & High-Reliability Applications

For applications where failure is not acceptable — stricter workmanship standards, tighter acceptance criteria, and full traceability on components and processes.

  • Medical devices, defence electronics
  • Automotive, aerospace systems
  • Any system where field failure is critical

Why Us

Why choose S.B. Electronics for assembly

Authentic Components

Sourced only through authorised distributors — certificates of conformance available.

AOI Inspection

Automated optical inspection on every board — solder joint and component presence verification.

Integrated with Fabrication

Assembly and fab under one roof — no misalignment between board and assembly specs.

Prototype to Production

1 piece NPI to high-volume production — same process standards, same quality team.

DFA Review

Design-for-assembly feedback before production starts — catching issues before they become rework.

India-Based

Gandhinagar factory — faster delivery within India, direct communication, no import delays.

Industries

Industries we assemble for

Consumer Electronics Industrial Automation Automotive Electronics Medical Devices Power Electronics Telecommunications IoT & Smart Systems Defence & Aerospace LED Lighting Renewable Energy

Related

Our other services

Fabrication, stencils, and sourcing — one partner for your full PCB program.

PCB Fabrication PCB Stencil Component Sourcing

Ready to assemble?

Send Gerber, BOM, and centroid data — we’ll respond with pricing and lead time.

Get instant quote Contact us