High-density multilayer boards on FR-4 Tg 150 °C / 170 °C with impedance control, dedicated power and ground planes, and controlled stack-up design. Prototype to production.
Layer Configuration
More layers increase routing density and signal integrity — but also increase cost and lead time. Our engineering team will help you select the optimal stack-up for your application.
Top signal, ground plane, power plane, bottom signal. Eliminates most EMI issues, improves return current paths. The most cost-effective step up from 2-layer for medium-density designs.
Two additional routing layers allow higher component density and more power rails. Common in industrial controllers, DSP boards, and complex communication modules.
Multiple power planes and signal layers for complex mixed-signal designs. Used in embedded computing, high-speed interfaces (DDR4, PCIe), and advanced industrial systems.
High-density interconnect designs for telecom, server, and networking equipment. Multiple shielded signal pairs and isolated power domains for demanding signal integrity requirements.
About Multilayer PCBs
Multilayer PCBs contain three or more conductive copper layers laminated together with insulating prepreg. Layers are interconnected using plated through-holes (vias). The internal layers can be dedicated as solid power and ground planes, dramatically reducing EMI, improving signal integrity, and simplifying routing compared to two-layer boards.
We manufacture 4 to 12 layer boards on high-grade FR-4 with Tg 150 °C and Tg 170 °C options. Our stack-up design service ensures correct dielectric thickness, controlled impedance traces, and proper prepreg selection before your order enters production.
Key Specifications
Surface Finishes
Solder Mask Colours
Share your layer count, stack-up requirements, and design files — we'll return a full quote with stack-up proposal.
Applications
Multilayer boards are required wherever component density, signal integrity, EMI control, or board real-estate constraints make double-sided designs insufficient.
Single board computers, ARM/RISC-V compute modules, and SoC carrier boards where DDR memory, high-speed peripherals, and tight BGA routing demand 6 to 8 layer stack-ups.
Base station processing boards, optical line terminals, and network switching blades require 8 to 12 layers with controlled differential-pair impedance for high-speed serial interfaces.
Ultrasound, MRI coil interfaces, and CT scanner signal conditioning boards — applications requiring multilayer isolation between analog, digital, and power domains.
Flight management computers, radar signal processors, and electronic warfare systems where high layer counts, Tg 170°C laminates, and impedance control are qualification requirements.
Variable frequency drives, servo amplifiers, and motor controllers using 4 to 6 layer boards with dedicated power planes for clean isolation between control and high-current circuits.
Gateway controllers, edge AI modules, and industrial IoT devices integrating wireless, wired connectivity, and processing — typically 4 to 6 layers with controlled impedance for RF traces.
Technical Capabilities
Standard parameters for our multilayer service. Higher layer counts and tighter tolerances available on request.
Other PCB Types
We manufacture the full PCB range from single sided to complex multilayer boards — all from our Gandhinagar facility.
Share your Gerber files and layer requirements — we'll return a stack-up proposal and quote.
